Advantech 12kW Solid State Pulse Amplifier (NEW O.E.M)
· Modular architecture
· Fast pulse rise/fall times ( · Duty cycle up to 12%
· Minimal pulse droop (<1% @ 100 µs)
· High stability (phase and amplitude)
· Gain compensation over temperature
· Remote monitor and control capability via RS485
· Input and output sample monitor ports
· Power factor correction
· Hot swappable elements
· No rear access required for operation or maintenance
The Advantech Wireless Model APRA-L12000A, L-Band solid-state pulse amplifier operates over the band of 1.2 – 1.4 GHz. The peak power at the output connector is 12,000W. The APRA-L12000A is fully modular. The design of the product is based on Advantech’s tradition of high power and high efficiency line of amplifiers.
Built-in features such as duty cycle monitor and pulse width monitor ensure trouble free operation.
The design of the APRA pulse amplifier is based on Advantech Wireless’ industry proven reliable solid state power amplifiers. The following is a description of the system elements and their salient features:
The APRA pulse amplifier contains the following elements:
· Redundant Input/Driver Module
· Splitter panel, one per amplifier chassis
· RF chassis each containing four 1.5 kW pulse amplifier modules
· Power supply modular package, one per amplifier chassis
· High-power Combiner
Redundant Input/Driver Module
This 1 RU unit contains hot-swappable 1:1 redundant driver modules and provides the M&C interface for the entire system.
The interface panel provides for::
· Input RS422 DB9 connector for the pulse enabling
· Output RS485 DB9 connector for the serial port interface
The Interface panel is connected to each amplifier module via the blind-mate connectors and also to the power supply shelves.
Input Splitter panel
The output of the Driver module passes through a 1:2 splitter and then to the 1 RU Input Splitter panel which is a 1:4 splitter. One is associated with each RF chassis. The output ports are accessible from the front. Each output port is connected to the input of each amplifier module.
The individual amplifier module provides 1.5 kW of output power. Each amplifier module is pre-adjusted for a normalized phase and gain. The units are hot-swappable. The input and output connectors are on the front of the module and all other connections are via a blind-mate connector at the back of the module. A micro-controller is included in each amplifier module to specify the timing specs and provide an RS485 interface. The amplifier module reports on fault conditions and internal temperature.
Due to the modular system architecture, a failed RF module may be removed safely and without service interruption. Furthermore, a single failed RF amplifier will cause only a 1.16 dB drop in the total output power of the system.
The RF chassis contains four (4) pulse amplifier modules. Each chassis is 6U high. The 10kW system contains two chassis.
Power supply shelf
A Power Supply shelf is associated with each chassis. The 1U high power supply shelf is modular, containing 3 individual power supplies. Failure of a single power module will have no impact on the operation of the system as they operate in a load-sharing configuration with two power supplies being sufficient to power the associated RF Chassis. The power supply modules are hot-swappable. The output of the power supply is connected to each amplifier module in the RF chassis via the blind-mate connector. The power supply shelf has an RS485 serial port for M&C
The high power combiner is contained in a 2U chassis having eight (8) inputs and a single output. The special design of the combiner emphasizes low insertion loss and high power handling capability. The input connectors are special N-type and the output is 7/16 type specially modified to avoid voltage breakdown and to ensure good thermal flow.
Monitor & Control System
The M&C system operates at the module level via RS485. The amplifier module reports on fault conditions and internal temperature. The power supply shelf also provides an RS485 serial port interface. The complete system may be monitored via the RS485 interface port on the Driver Module. A laptop may also be used with appropriate adapter.
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